TM2TR64EPH, TM4TR64EPH TM2TR72EPH, TM4TR72EPH SYNCHRONOUS DYNAMIC RAM MODULES

SMMS702

Subcomponent = yes>

Subcomponent = yes>A

Subcomponent = yes>B

features

• Organization:
  • TM2TR64EPH . . . 2 097 152 x 64 Bits
  • TM4TR64EPH . . . 4 194 304 x 64 Bits
  • TM2TR72EPH . . . 2 097 152 x 72 Bits
  • TM4TR72EPH . . . 4 194 304 x 72 Bits
• Single 3.3-V Power Supply (±10% Tolerance)
• Designed for 100-MHz 4-Clock Systems
• TM2TR64EPH -- Uses Eight 16M-Bit Synchronous Dynamic RAMs (SDRAMs) (2M × 8-Bit) in Plastic Thin Small-Outline Packages (TSOPs)
• TM4TR64EPH -- Uses Sixteen 16M-Bit SDRAMs (2M × 8-Bit) in Plastic TSOPs
• TM2TR72EPH -- Uses Nine 16M-Bit SDRAMs (2M × 8-Bit) in Plastic TSOPs
• TM4TR72EPH -- Uses Eighteen 16M-Bit SDRAMs (2M × 8-Bit) in Plastic TSOPs
• Byte-Read/Write Capability
• Performance Ranges:
• JEDEC 168-Pin Dual-In-Line Memory Module (DIMM) Without Buffer for Use With Socket
• High-Speed, Low-Noise

  Subcomponent = yes>, Low-Voltage TTL (LVTTL) Interface

  	SYNCHRONOUS CLOCK CYCLE TIME		ACCESS TIME CLOCK TO OUTPUT		REFRESH INTERVAL
  	tCK3 (CL = 3)†	tCK2 (CL = 2)	tAC Subcomponent = yes>3 (CL = 3)	tAC Subcomponent = yes>2 (CL = 2)
  'xTRxxEPH- Subcomponent = yes>10 Subcomponent = yes>8 Subcomponent = yes>A	Subcomponent = yes>10 Subcomponent = yes>8 ns	1 Subcomponent = yes>0 Subcomponent = yes>0 ns	6 ns	Subcomponent = yes>6 Subcomponent = yes>6 ns	64 ms
  'xTRxxEPH- Subcomponent = yes>10 Subcomponent = yes>8A	Subcomponent = yes>10 Subcomponent = yes>8 ns	1 Subcomponent = yes>5 Subcomponent = yes>5 ns	6 ns	Subcomponent = yes>8 Subcomponent = yes>7 Subcomponent = yes>.5 ns	64 ms

  ^† CL = CAS latency - JANUARY 1998

  Subcomponent = yes> - REVISED

  Subcomponent = yes>MARCH

  Subcomponent = yes>APRIL 1998

TM2TR64EPH, TM4TR64EPH TM2TR72EPH, TM4TR72EPH SYNCHRONOUS DYNAMIC RAM MODULES

SMMS702 - JANUARY 1998

• Read Latencies 2 and 3 Supported
• Support Burst-Interleave and Burst-Interrupt Operations
• Burst Length Programmable to 1, 2, 4, and 8
• Two Banks for On-Chip Interleaving (Gapless Access)
• Ambient Temperature Range 0°C to 70°C
• Gold-Plated Contacts
• Pipeline Architecture
• Serial Presence

  Subcomponent = yes>-

  Subcomponent = yes> Detect (SPD) Using EEPROM

  Subcomponent = yes>

  Subcomponent = yes>

  Subcomponent = yes>

description

The TM2TR64EPH is a 16M-byte, 168-pin DIMM. The DIMM is composed of eight TMS626812BDGE

Subcomponent = yes>, 2097152 x 8-bit SDRAMs, each in a 400-mil, 44-pin plastic TSOP mounted on a substrate with decoupling capacitors. See the TMS626812B data sheet (literature number SMOS693).

The TM4TR64EPH is a 32M-byte, 168-pin DIMM. The DIMM is composed of sixteen TMS626812BDGE 2097152 x 8-bit SDRAMs, each in a 400-mil, 44-pin plastic TSOP mounted on a substrate with decoupling capacitors.

The TM2TR72EPH is an 16M-byte, 168-pin DIMM. The DIMM is composed of nine TMS626812BDGE 2097152 x 8-bit SDRAMs, each in a 400-mil, 44-pin plastic TSOP mounted on a substrate with decoupling capacitors.

The TM4TR72EPH is a 32M-byte, 168-pin DIMM. The DIMM is composed of eighteen TMS626812BDGE 2097152 x 8-bit SDRAMs, each in a 400-mil, 44-pin plastic TSOP mounted on a substrate with decoupling capacitors.

View more information about generic part numbers:TM2TR64EPH, TM2TR72EPH, TM4TR64EPH, TM4TR72EPH

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(c) Copyright 1998 Texas Instruments Incorporated. All rights reserved.
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