TRF8011 900-MHz RF TRANSMIT DRIVER

SLWS056B - FEBRUARY 1997 - REVISED OCTOBER 1997

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments Incorporated.

features

• Operates from 4.8-V Power Supply for 900-MHz Applications
• Unconditionally Stable
• Wide UHF Frequency Range: 800 MHz to 1000 MHz
• 24.5 dBm Typical Output Power
• Linear Ramp Control
• Transmit Enable/Disable Control
• Advanced BiCMOS Processing Technology for Low-Power Consumption, High Efficiency, and Highly Linear Operation
• Minimum of External Components Required for Operation
• Thermally Enhanced Surface-Mount Package for Extremely Small Circuit Footprint

description

The TRF8011 RF transmit driver amplifier is for use in 800 to 1000 MHz wireless communication systems. It consists of a two-stage amplifier and a linear ramp controller for burst control in TDMA (time-division multiple access) applications. Very few external components are required for operation. The input is dc-blocked and requires no external matching. The output requires external matching suitable for the application frequency.

The device is enabled when the TXEN input is held high. A power control signal applied to the VPC input can ramp the RF output power up or down to meet ramp and spurious emission specifications in TDMA systems. The power control signal causes a linear change in output power as the voltage applied to VPC varies between 0 V and 3 V. With the RF input power applied to RFIN at 5 dBm and TXEN high, adjusting VPC from 0 V to 3 V increases the output power from a typical value of -50 dBm to 24.5 dBm at 900 MHz. Forward isolation with the input power applied to RFIN at 5 dBm, VPC = 0 V, and TXEN high is typically greater than 50 dB.

The TRF8011 is available in a thermally enhanced, surface-mount, 20-pin PowerPAD^TM (PWP) thin-shrink small outline package (TSSOP) and is characterized for operation from -40°C to 85°C. The PWP package has a solderable pad that can improve the package thermal performance by bonding the pad to an external thermal plane. The pad also acts as a low-inductance electrical path to ground and must be electrically connected to the PCB ground plane as a continuation of the regular package terminals that are designated GND.

View more information about generic part numbers:TRF8011

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