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SCBS013F - SEPTEMBER 1988 - REVISED APRIL 1994
features
- State-of-the-Art BiCMOS Design Significantly Reduces ICCZ
- ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015
- 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
- Package Options Include Plastic Small-Outline (DW) and Shrink Small-Outline (DB) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W), and Standard Plastic and Ceramic 300-mil DIPs (J, N)
description
These octal bus transceivers are designed for asynchronouscommunication between data buses. The devices transmit data from theA bus to the B bus or from the B bus to the A bus depending upon thelevel at the direction-control (DIR) input. The output-enable () input can be used to disable thedevice so the buses are effectively isolated.
The SN74BCT245 is available in TI's shrink small-outline package(DB), which provides the same I/O pin count and functionality ofstandard small-outline packages in less than half theprinted-circuit-board area.
The SN54BCT245 is characterized for operation over the fullmilitary temperature range of -55°C to 125°C. TheSN74BCT245 is characterized for operation from 0°C to 70°C.
Title: OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS
Product Family: UNIVERSAL BUS TRANSCEIVERS (UBTS)
Device Functionality: BUS TRANSCEIVER
Orderable Devices: SNJ54BCT245FK, SNJ54BCT245J, SNJ54BCT245W, SN74BCT245DBLE, SN74BCT245DW, SN74BCT245DWR, SN74BCT245N
View the complete PDF datasheet: scbs013f.pdf (96 K Bytes) (Requires Acrobat Reader 3.x)View more information about generic part numbers:SN54BCT245, SN74BCT245
Go to the Engineering Design Center to locate information on other TI Semiconductor devices.




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