TMS320C6201 (REVISION 2.X) TO TMS320C6201B (REVISION 3.X)

Samples of the Texas Instruments (TI™) TMS320C6201B DSP will be available in the second half of 1998, with volume production starting at the end of the year. The TMS320C6201B revision is manufactured using a 0.18-micron process compared to the currently available revision 2 that uses a 0.25-micron process. The use of a smaller process for the TMS320C6201B DSP will lead to significantly lower power dissipation as well as lower cost. The new data memory structure will allow simultaneous word accesses by both sides of the CPU and the DMA during a single cycle.

This document is intended to enable TMS320C6201 designers to anticipate the migration of their design to the TMS320C6201B and take advantage of the benefits of this revision.

The following lists the changes implemented by the TMS320C6201B compared to the TMS320C6201:

Core voltage changed from 2.5V to 1.8V

The new core architecture will be run at a lower voltage to provide less power consumption by the device.

Dual blocks of Internal Data Memory

64k-byte Data memory now divided into two 32K-byte blocks, with four 4K-byte banks per block.

Thermal balls added for additional heat dissipation

A 10 x 10 array of thermal balls are included on the underside of the device to be connected to the ground plane for additional heat dissipation.

Voltage input to PLLV changed to 3.3V

The PLL circuit will be powered by the I/O voltage supply, rather than by the core voltage supply.

Go to the Engineering Design Center to locate information on other TI Semiconductor devices.

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