TMS320C6X MANUFACTURING WITH THE BGA PACKAGE

This document describes how to solder the Texas Instruments (TI(TM)) TMS320C6x digital signal processor (DSP) to a board. The TMS320C6x DSP is manufactured in the BGA package due to its smaller size, greater pitch, higher manufacturing yields, lower manufacturing cost, better electrical performance at high frequency, and increased durability over pinned devices. Because many DSP products are switching over to this package style, it is important to know the manufacturing considerations that must be taken into account when building a board.

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