EDI'S X32 MCM-L SRAM FAMILY: INTEGRATED MEMORY SOLUTION FOR TMS320C4X DSPS

Memory modules have long been a system designer's trump card. Modules, in addition to the traditional space savings, allow ease of implementation, known operating performance, flexible density options and the ability to move across technology boundaries (i.e. CMOS to BiCMOS) without changing their system board design. As technology innovations continue, both at the chip and assembly levels, modules are no longer saddled by performance penalties associated with system board interfaces. Today's modules achieve equivalent or in some cases improved performance over traditional monolithic approaches. This performance improvement is linked to reductions in capacitance and inductance as well as improved power planes and signal line impedance versus a monolithic solution. This application report will show how these benefits can be taken advantage of in a system design using Texas Instrument's TMS320C4x DSPs.

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