IMPLEMENTING SPLIT SPECTRUM PROCESSING WITH A TMS320C26 DSP

The ultrasonic evaluation of specimens with large microstructures can be difficult because of interference caused by the grains in the material. The split spectrum processing (SSP) filtering technique effectively reduces this type of noise by employing a bank of filters followed by a nonlinear detector that increases signal-to-noise ratios.

This application report describes the benefits of implementing SSP using the Texas Instruments (TI™) TMS320C26 digital signal processor (DSP). The high performance capability of the TMS320C26 DSP offers a quick and efficient means of conducting SSP, which means researchers can now freely experiment with SSP filter parameters and obtain almost instantaneous results.

In addition, previously time-consuming filtering applications (such as MATLAB simulations and two- and three-dimensional SSP) are now more practical because they can be accomplished much faster.

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