FIFO MEMORIES: SURFACE-MOUNT PACKAGES FOR PCMCIA APPLICATIONSThe continuing need to reduce board space without reducing functionality has carried over to PCMCIA cards. PCMCIA card designers are challenged to reduce the size of their boards to the size of a credit card. TI meets this demand with the TQFP packaging of their advanced CMOS and BiCMOS FIFOs. This document briefly describes the three types of PCMCIA cards, the TQFP packaging of the 9-, 18-, and 36-bit FIFOs, their power consumption, and the thermal resistance of the devices. View the complete PDF document: sdma001a.pdf (89 K Bytes) (Requires Acrobat Reader 3.x) Go to the Engineering Design Center to locate information on other TI Semiconductor devices.
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