RECENT ADVANCEMENTS IN BUS-INTERFACE PACKAGING AND PROCESSING

Designers need a wide range of fine-pitch surface mount packages to meet today’s systems constraints in broad area and total volume. The SSOP and SQFP packages allow bus-interface logic devices to meet the wider data bus trends and provide superior electrical performance while minimizing space requirements. This document discusses the evolution of bus-interface packages, their impedance, the 3.3-V operation, and advanced bus-interface solutions using the SSOP package.

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