K-FACTOR TEST-BOARD DESIGN IMPACT ON THERMAL IMPEDANCE MEASUREMENTSThermal impedance (junction to ambient) is one of several indices reported to reflect the thermal performance of a package. This document shows the impact of the wind-tunnel k-factor test-board design parameters on thermal impedance results. It presents a software modelling approach using the THEATACAL software package. The design and results are provided with an analysis of the variance. Verification of the design is also included within the document. View the complete PDF document: scaa022a.pdf (69 K Bytes) (Requires Acrobat Reader 3.x) Go to the Engineering Design Center to locate information on other TI Semiconductor devices.
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