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In 1987, Texas Instruments began a relationship with U.S. Robotics to incorporate high-performance DSPs into modem design and production. Over ten years later, this relationship between the two communications giants continues to generate ideas that are on the edge of technology.

Today, TI and 3Com continue the relationship with a strategic initiative to deliver a family of affordable and upgradeable modems, supporting both dial-up access and DSL technologies. Since 1997, this team has engaged in joint development, joint problem solving and joint marketing of the x2 technology, with some very positive results.

TI's DSP chipset has been a catalyst for 3Com's retail leadership and growth in voiceband modems. 3Com has repeatedly been first to market with the most advanced, fastest retail modems, due in large part, to the chipset's programmability, and 3Com's software expertise. This feature enables 3Com's modems to be easily upgraded to faster implementations and new enhancements through a simple software download from the Internet.

To date, TI has shipped more than 30 million x2/V.90 capable chipsets in support of 3Com/U.S. Robotics modem platforms. Through its size and innovation, TI has been a reliable partner to 3Com, assuring a constant supply of DSPs to fuel its growing modem production and continued leadership in the telecommunications market.