3Com Expo '98 Home

EXHIBITS:

Join us throughout the day to listen, see and touch the latest in communications technology demonstrations. Texas Instruments and select third parties will showcase high-level communications solutions that will enable you to view a cross section of innovations.

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TECHNOLOGY TRACKS:

The most recent market trends and future predictions will be unveiled to you when you join us for these high-tech tracks. Learn about the past, present and future from respected industry analysts who provide their perspectives on market issues that are critical to our mutual success. In addition, hear from 3Com and TI management about plans to move together into the next century.

Technology Track 1: Voiceband Modems - Still Prime Time
"Analog Modem Market Dynamics and Transitions to Digital Networks"
Panelists:

• Salim Ling, Vice President of Research and Development, 3Com (Panel Moderator)
• Cheryl Currid, President, Currid & Company
• Keith Barber, Datacommunications Product Line Manager, TI
• Darrell Whitten, Strategic Programs Manager, Datacommunications, TI

Technology Track 2: Making Waves in the Modem Pool
"High Density Modems in Remote Access Applications"
Panelists:

• Dan Schoo, Director of Research and Development, 3Com (Panel Moderator)
• Geoff Ballew, Senior Analyst, Dataquest
• Phil Campbell, DSP Datacommunications Manager, TI
• Irvind Ghai, Datacommunications Engineering Manager, TI

Technology Track 3: Turbo Charging the Telephone Lines
"The Evolution of Digital Subscriber Lines"
Panelists:

• Daniel Briere, President, TeleChoice, Inc.
• Charlie Gonsalves, Strategic Marketing Manager, TI
• Terry Riley, Director of Business Development for Broadband Access Products, TI

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TUTORIALS

These technical tutorials offer advanced discussions on how TI and 3Com will move forward with current and future technologies. Get in-depth information about DSP and Mixed Signal roadmaps, architecture advancements and new, state-of-the-art DSP development tools.

Advanced DSP Architecture:
Ray Simar, Architectural Development Manager, TI Fellow, TI
Gene Frantz, TI Senior Fellow/DSP, TI

From semiconductor processors to chip architectures, TI's top innovators look beyond the horizon to share a snapshot of the factors driving next generation DSPs. In addition, in-depth discussions on emerging market applications and the DSPs that drive them will be conducted by two of TI's leading DSP technologists.

Advanced Mixed Signal Technology:
Darrell Whitten, Strategic Programs Manager, Datacommunications, TI
Ming Chiang, Vice President, Mixed Signal Products Development, TI
Bill Severin, Department Manager, MSDS Product Design, TI

New developments in Codec performance, roadmaps for TIs mixed signal datacommunications products and mixed signal integration with DSP will be the hot topics for this high-level tutorial.

Advanced DSP Solutions Development Tools:
Tim Birus, ‘C5000/Lead Project Manager, TI
Jim Lake, Tactical Marketing Manager, RTA/OS Products, TI Santa Barbara

Through easy to use tools and development environments, see how TI's latest acquisitions and tools strategy bring a time-to-market advantage to 3Com.

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