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New TMS320C54x DSPs from TI Combine Industry's Lowest Power Dissipation with Highest Performance in Smallest Space

TMS320VC549 & TMS320VC5410 Chips HOUSTON (June 29, 1998) -- Two new digital signal processors from Texas Instruments (TI) (NYSE: TXN) combine the industry's lowest power dissipation with 100 MIPS of performance into a package the size of a thumbnail. These power-efficient, ultra-small DSPs, designated the TMS320C549 and the TMS320C5410, will enable designers of wireless and wireline communications systems to provide more channels per watt than any other DSPs on the market.

With active power dissipation less than 115 mW at 100 MIPS and up to 64K words of on-chip SRAM, no other DSP can claim this level of integration and performance in a package as small as TI's microStar™ BGA (Ball Grid Array), measuring 12 X 12 X 1.4 mm.

The integration levels of the 'C549 and 'C5410 open the door for new space-constrained DSP applications like digital radios; surgically implanted hearing aids; global positioning system (GPS) terminals; portable information appliances that combine voice, data and video; and a variety of infrastructure end-equipments.

"Our customers, who are developers of high-value open telecommunications solutions, are asking for more of everything -- processing power, memory, capacity and cost-efficiency," said Brough Turner, co-founder and chief technology officer of Natural Microsystems. "The performance-per-watt of TI's 'C54x generation of DSPs clearly exceeds that of any other DSP on the market. In addition, the new 'C5410 DSPs provide optimal matching of MIPS to on-chip memory and a direct connections to interface components for the industry standard H.100/H.110 telecommunications buses. Natural Microsystems is able to leverage these technical advantages to produce open telecommunications platforms with the best performance per watt, per slot and per dollar in both PCI and CompactPCI form factors."

"No one in the industry can pack this much performance and this much memory -- operating on such little power -- into these ultra-small packages," said Mark Mattson, 'C5000 platform marketing manager, Texas Instruments. "High-performance DSPs that are small and power-efficient are fueling trends like the convergence of voice and data in a variety of portable and infrastructure end-equipments."

"DSP-based CTI applications, like voice-over-IP, fax and data communications constantly demand that we process more data faster," said Luis F. Ortiz, director of core technology at Brooktrout Technology, Inc. "The larger on-chip memory on the 'C5410 allows us to quickly increase the performance of existing designs by upgrading the DSPs and software. The MCBSP and DMA enhancements let us move more data on-chip with less overhead on new products currently under design for 1998 and the 'C5000 platform still has amazingly low power consumption."

Cutting Costs and Reducing Size

The 'C5410 DSP includes new input/output (I/O) peripheral functionality on-chip that can cut system costs and save board space by eliminating external discrete devices. A new multi-channel buffered serial port (MCBSP) performs functions that were previously accomplished in an off-chip ASIC (application specific integrated circuit), FPGA (field programmable gate array) or PLD (programmable logic device). The MCBSP connects to a telecommunications carrier's high-capacity T1/E1 line via a framer chip and handles the data sorting and companding functions. The handling of multiple communications channels in conformance with new standards such as H.100 is critical for many new CTI applications.

A six-channel direct memory access (DMA) controller on the 'C5410 helps provide increased flexibility and sustains peak performance rates. The DMA can enable program overlays independent of CPU intervention. This assures the 'C5410 will be able to sustain peak MIPS performance over a variety of algorithmic loadings.

Scalable DSPs Lead to Flexible Systems

Like the entire 'C54x generation, the 'C549 and 'C5410 are easily scaled and reconfigured to match the needs of many applications with diverse requirements. For example, a telecommunications OEM could develop a board with two 'C54x DSPs capable of 200 MIPS of processing power. Because of the flexibility of the new DSP, the resources on-board could be used to implement eight voice compression (vocoders) algorithms, each requiring 25 MIPS, or, in another application, the board's capabilities might be reconfigured to handle 40 channels of echo cancellation or to generate dual-tone multi-frequency (DTMF) for 100 telephone lines. This re-allocation of DSP resources can be done off-line or dynamically by the system itself to meet the changing needs of an application.

Easy Migration Path

"The 'C54x generation is a recognized industry leader in wireless, telecom and networking applications. Since the 'C549 and 'C5410 can use software code developed for earlier members of the 'C54x generation, these new DSPs offer designers an easy migration path to next-generation LAN (local area network) equipment, digital PBXs (private branch exchanges), wireless local loop systems and many new applications that capitalize on the continuing convergence of voice and data," Mattson said.

Designers who have used previous members of the 'C54x generation will have an easy migration path to the expanded capabilities of the 'C549 and 'C5410. Software development time is virtually eliminated because any code that is running on one of the prior members of the 'C54x generation will be directly portable to the new 'C549 or 'C5410 DSPs. To assure that little, if any, layout and design work must be done, the 'C549 and 'C5410 are available in a 144-pin TQFP (thin quad flat pack) package, in addition to MicroStar BGAs.

  Development Tools Speed Products to Market

A complete suite of development tools are available today to support code generation, simulation and emulation. Hardware development platforms are available from TI, TI's authorized distributors and TI's third parties.

Pricing and Availability

The 'C549 and 'C5410 are available in two packaging options: a TQFP (thin quad flat pack) that ensures portability for existing 'C54x customer, and TI's space-saving microStar ball grid array (BGA), which reduces space requirements beyond that of the TQFP.

Samples of the 'C549 are available now with production quantities scheduled for the 3Q98. Samples of the 'C5410 are planned for October 1998 and production quantities are scheduled to be available in the 2Q99. Pricing for production quantities of 10,000 is expected to be $25 for the 100 MIPS 'C549 in 3Q98, and $29.85 for the 100 MIPS 'C5410 in 2Q99.

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