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NOTE: Signal names ending with the following character '^' indicate an active low signal.

Example: RETRY^ is active low.

Identifying the C80 Device Revision

The revision number for each C80 device may be determined by the device symbolization located in the upper right hand corner on the top of the device package. The device revision is identified by the first two numbers in the third line of the device symbolization. The example device symbol shown here indicates a Rev 3.0 device.


  TMS

  320C80GF

  E30-56CETET

    \

     Revision Code


Device Speeds:

  • Revision 1.x devices are limited to 25 MHz operation (50 MHz CLKIN). Parameter tc(CKI) must be at least 20 nS minimum.

  • Revision 2.x devices are limited to 25 MHz operation (50 MHz CLKIN). Parameter tc(CKI) must be at least 20 nS minimum.

  • Revision 3.x and later devices: Refer to data sheet.

Silicon 3.x Device Errata:

The following errata exists on silicon version 3.x devices.

3.1 No Synchronizer on LINT4:

The level-sensitive interrupt (LINT4) on the MP is not passed through a synchronizer before being sampled by INTPEN. If a bad level is sampled due to the signal changing as the sample is taken, this can cause unpredictable behavior.

Work Around:
Synchronize the interrupt externally or don't use this interrupt.

Problem exists for silicon revisions: 1.0, 1.1, 1.2, 2.0, 3.0 and 3.1

Fix proposed for silicon revision: 4.0 and later.

3.2 HTOTAL Greater Than Line Length:

If a Frame Timer(FT) within the Video Controller(VC) is configured for external synchronization and its HTOTAL register is programmed to a value which is longer than the line length of the external signal, then the MP interrupt will NOT occur. MP interrupt refers to bit f0 or f1 of the MP's INTPEN register, as appropriate.

Currently the interrupt signal waits for the HCOUNT=HTOTAL condition to activate the interrupt signal to the MP, which doesn't occur in this case.

 

                         HCOUNT=HTOTAL

        END OF --+        |  Interrupt would occur here,

       EXTERNAL  |        |  but this condition

       LINE      V        V  doesn't occur!

 _________________________

|                X        |

|   SCREEN       X        |

|                X        |

|________________X________|

Work Around:
Program the horizontal line length (HTOTAL register) of the FT to be the same as the externally applied source line length.

Problem exists for silicon revisions: 1.0, 1.1, 1.2, 2.0, 3.0 and 3.1

Fix proposed for silicon revision: 4.0 and later.

3.3 d0[F]/sr[R] bug in PP:

The problem occurs when using d0[F] to switch an EALU instruction from being "maskgen" (%) to "mf spreading" (@mf). If there is NOT a "multiple" function modifier, then the value written back to the mf register should be rotated according to the R bit/Msize combination. The problem is that the mf register is NOT being rotated in this case, even when R=1.

Work Around:
Do NOT try to rotate the mf register using the R bit when using d0[F] to switch an EALU instruction from being "maskgen" (%) to "mf spreading" (@mf). Use a function modifier to do rotation.

Problem exists for silicon revision: 3.0 and 3.1
d0[F] bit did not exist in earlier versions.

Fix proposed for silicon revision: 4.0 and later.

3.4 Variable Patch Guided Packet Transfer Problem:

The following packet transfers will not execute correctly: variable patch guided for either src or dst where the penultimate guide table entry has Acount and Bcount both equal to zero, in systems where the caches are being serviced from either 2 or 3 cycle per column memory. Src packet transfers of this type will additionally generate a bad packet interrupt.

Work Around:
Remove the guide table entry completely
OR change the Bcount to 1 if the Acount is 0.

Problem exists for silicon revisions: 1.0, 1.1, 1.2 and 2.0
for Dst packet transfers of this type.

Verified fixed for silicon revision: 3.0 and later
for Dst packet transfers of this type.

Problem exists for silicon revisions: 1.0, 1.1, 1.2, 2.0, 3.0 and 3.1
for Src packet transfers of this type.

Fix proposed for silicon revision: 4.0 and later for Src packet transfers of this type.

3.5 Late TRG^ and W^ Active During RETRY^:

If RETRY^ is asserted to generate multiple MRS cycles, the TRG^ and W^ signals in the MRS cycles during which RETRY^ is active will go active later than expected. The inactive going edges are unaffected. This is only going to affect systems in which multiple banks of SDRAM are present.

The following is the corrected timings for the data sheet to be used only for those silicon revisions which have the errata.

Item number Datasheet Specification 40MHz 50MHz
23 th(OUTV-CKOL) ntH-13.0 ns ntH-10.0 ns
24 th(OUTV-CKOL) ntH-13.0 ns ntH-10.1 ns
27 th(OUTV-OUTV) ntH-13.0 ns ntH-11.0 ns
28 td(CKOH-OUTV) ntH+13.0 ns ntH+11.0 ns
29 td(CKOL-OUTV) ntH+13.0 ns ntH+11.0 ns
32 td(OUTV-OUTV) ntH+13.0 ns ntH+11.0 ns
33 tw(OUTV) ntH-13.0 ns ntH-11.0 ns

Work Around: None.

Problem exists for silicon revision: 3.0 and 3.1
There are no SDRAM cycles for previous revisions.

Fix proposed for silicon revision: 4.0 and later.

3.6 Power-up DCAB cycles sensitive to RETRY^:

If RETRY^ is sampled active during the power-up DCAB cycle, another DCAB cycle will be performed subsequently (as per MRS). It is probable that neither the C80 nor the user's system will be affected by more than one power-up DCAB cycle. However, if the user's decode logic asserts RETRY^ during the power-up DCAB cycle, the chances are it will continue to do so during the subsequent DCAB cycles erroneously generated by the RETRY^, and the system will perform power-up DCAB cycles ad infinitum.

Work Around:
Ensure RETRY^ is not low at the sample point for power-up DCAB cycles.

Problem exists for silicon revision: 3.0 and 3.1

Fix proposed for silicon revision: 4.0 and later.

3.7 Low Level Switching Noise Seen on C80 Output Pins:

Under certain conditions associated with multiple output drivers switching from a logic one to a logic zero, low level glitches can occur. Figure 35 in the device datasheet (titled 'TTL Level Outputs') shows 0.6v as the absolute VOL level and 0.8v as the value used to guarantee output pin timing. Instead of testing to 0.6v & 0.8v, the following table describes the guaranteed values (tested in manufacturing test):


   VCC       Tc (Case Temperature)     VOL (Max)
================================================

 < = 3.3V        > =  25 ° C            0.98V

VOL performance degrades as VCC exceeds 3.3v and/or temperature goes below 25 Degrees C. Manufacturing test checks for VOL values above 0.98v under these test conditions.

Work Around:none

Problem exists for silicon revision: 3.0

Fix proposed for silicon revision: Revision 3.1 is expected to improve performance of this parameter.

3.8 Sampling RETRY^ at column time:

The sampling of RETRY^ during the column time pipeline will not force the C80 to relinquish control of the address and data buses. The pipeline IS flushed. The sampling of RETRY^ during column accesses is supposed to force the memory interface back to the r1 state. However, the memory interface will not return to the r1 state until the next access starts. Occasionally, this may be some considerable time later.

Work Around:
This is normally only a problem for systems during debug, when long periods of bus inactivity are frequent, or in systems which turn off the refresh controller. Systems which use shared resources without refreshes or those which need to force the C80 to relinquish control of the address and data buses immediately can use the HREQ^ pin instead.

Problem exists for silicon revisions: 1.0, 1.1, 1.2, 2.0, 3.0 and 3.1

Fix proposed for silicon revision: 4.0 and later.

3.9 DBEN^ not driven inactive:

It is possible that DBEN^ will not be driven inactive in the first r1 in a sequence of r1 states. DBEN^ may be driven inactive in any r1 state in a sequence of r1 states, but at the very least it will be driven inactive in the last r1 state of that sequence.

In addition, that sequence of r1 states may be interrupted by the activation of HREQ^. In this case DBEN^ may not be driven inactive until the r1 sequence completes i.e after the deactivation of HREQ^. DBEN^ still goes to a high impedance state during a Host Request.

Work Around: Not needed.

Problem exists for silicon revisions: 2.0, 3.0 and 3.1

Fix proposed for silicon revision: 4.0 and later.

3.10 READY sampled during column cycles with no CAS^ signals active:

The C80 can perform column accesses in which none of the CAS^ signals are active. During such cycles the C80 samples READY in the normal way. This may cause problems if the external control of READY is not qualified with CAS^ active. i.e If READY is being held inactive waiting for a count of CAS^ active cycles, the memory interface can then become locked as there could be no CAS^ active cycles. This applies to 2 and 3 cycles per column memory timings (Those which support column time Wait-States).

Work Around:
Don't assert READY during column accesses until CAS^ is active. If this is not possible for 2 cycle/column memory timings, then use three cycle/column memory timings with one less waitstate.

Problem exists for silicon revisions: 1.0, 1.1, 1.2, 2.0, 3.0 and 3.1

Fix proposed for silicon revision: 4.0 and later.

3.11 MP Data Cache Control Register Access:

A hazard exists when reading or writing to/from an MP Data cache control register(16 TAG Registers and the LRU register) while the Data cache is being serviced(such as a cache miss or cache flush). Erroneous values could be retrieved.

Work Around:
The user can ensure that any cache service completes before accessing the Cache control registers by using a 'dummy' load before the rdcr/wrcr instruction.


(save value of global interrupt first)

(disable global interrupt)

ld r0(r0),r0   ; dummy load to stall MP's pipeline

(restore global interrupt afterwards)

rdcr/wrcr instruction

            

Problem exists for silicon revisions: 1.0, 1.1, 1.2, 2.0, 3.0 and 3.1

Fix proposed for silicon revision: 4.0 and later.

See also: errata 2.7 and 2.8

3.12 External to External Packet Transfers:

If a packet transfer(PT) with a source address that is off-chip has a destination address which changes from off-chip to on-chip and the off-chip source data is greater than 120 bytes, erroneous behavior will occur.

If the destination address changes from on-chip to off-chip OR if the source address is on-chip the device works correctly.

Work Around:
Packet transfers in which the source address is off-chip and the destination address changes from being off-chip to being on-chip should be avoided unless the off-chip source data is less than 120 bytes.

OR: The PT can be separated into two or more PTs so that the off-chip to on-chip change does not occur within a single PT or until the off-chip source data is less that 120 bytes.

Problem exists for silicon revisions: 1.0, 1.1, 1.2, 2.0, 3.0 and 3.1

Fix proposed for silicon revision: 4.0 and later.

3.13 Peripheral Device Packet Transfers:

For peripheral device packet transfers(PDPT), if Acount is not set to 0 in the source parameters for writes or in the destination parameters for reads, unknown behavior will occur for the transfer. This parameter is listed as "unused" in the TC User's Guide.

Work Around:
For PDPTs, set Acount = 0 in the source parameters for writes or in the destination parameters for reads.

Problem exists for silicon revisions: 2.0, 3.0 and 3.1
PDPTs did not exist for silicon revisions earlier than 2.0.

Fix proposed for silicon revision: 4.0 and later.

3.14 Peripheral Device Packet Transfers:

The TC User's guide states that when setting up a Peripheral Device Packet Transfer(PDPT), the unused machine (source for writes and destination for reads) should be set up so that its start address is 0 with Bcount and Ccount listed as "unused". This is supposed to be sufficient to ensure that the unused machine is inactive. In fact, if Bcount or Ccount is non-zero the unused machine will NOT be inactive.

Work Around:
When setting up the parameters for a PDPT, one should set
Bcount = Ccount = Start Address = 0 in the source parameters for writes or in the destination parameters for reads.

Condition exists for silicon revisions: 2.0 and later
PDPTs did not exist for silicon revisions earlier than 2.0.

Fix proposed for TC User's guide.
The TC user's guide will be changed to indicate that Bcount, Ccount and the Start Address for the unused machine MUST be 0.

3.15 Data corruption when mixing long and short read latencies:

The problem can occur in systems which utilize both the 3 cycle read latency synchronous DRAM AND unpipelined one cycle per column memory timings. Furthermore, both types must be read from within an external to internal packet transfer which has guided transfer destination parameters. Under certain circumstances too complicated to go into in detail, the transition from the SDRAM to the unpipelined 1 cycle per column timings can cause one byte of the data to get corrupted.

Work Around:
Don't read from both memory types from within a packet transfer of the type described above.

Problem exists for silicon revisions: 3.0 and 3.1
Synchronous DRAM support did not exist for previous revisions.

Fix proposed for silicon revision: 4.0 and later.

(NEW)
3.16 Address validity checked at wrong time:

When performing either an offset or delta-guided packet transfer, the TC incorrectly checks the validity of the base address before the offset or delta is added. If the base address (src or dst) is invalid, the packet transfer terminates with a fault.

Work Around:
Ensure that the base address(es) for offset and delta-guided transfers are valid before issuing the transfer.

Problem exists for silicon revisions: 1.0, 1.1, 1.2, 2.0, 3.0 and 3.1

Fix proposed for silicon revision: 4.0 and later.

(NEW)
3.17 Error in Packet Transfer Status (PTS) Reporting:

PTS is generated with a raw dst fault signal, unqualified with whether the dst address is on-chip or off-chip. On-chip or off-chip addresses are determined by the 7 MSBs of the address. Because of this, when performing a PT, a problem will arise when:

  • an on-chip src address produces a fault AND
  • the dst address is off-chip AND
  • the 25 LSBs of the dst address (assuming the 7 MSBs are 0s) point to an illegal on-chip address. For example, a dst address of 0x80004000 is interpreted by the fault detection logic as the illegal on-chip address of 0x00004000.

PTS incorrectly reports that a dst fault has occured when in fact a src fault has occurred.

Work Around: None.

Problem exists for silicon revisions: 1.0, 1.1, 1.2, 2.0, 3.0 and 3.1

Fix proposed for silicon revision: 4.0 and later.

(NEW)
3.18 XPT input Synchronzation Problem:

The Transfer Controller User's Guide indicates that the XPT lines are internally synchronized within the C80. This would indicate that externally, the XPT lines can be asserted asynchronously with respect to the clock. However, the synchronizer within the C80 for the XPT lines is not operating correctly. Because of this, signal skew between the XPT inputs can cause an invalid level to be recognized.

For example, a waveform such as the following, can cause XPT2 (coding 101) to submitted instead of XPT3 (coding 100).


          _____       _____

CLKOUT   /     \_____/     \_

         ____________________

XPT[2]    is HI

         _________    

XPT[1]            \__________

                  : :

         ___________: 

XPT[0]            : \________

                  : :

                --: :--skew 

Work Around: Synchronize the XPT inputs externally to the rising edge of CLKOUT.

Problem exists for silicon revisions: 1.0, 1.1, 1.2, 2.0, 3.0 and 3.1

Fix proposed for silicon revision: 4.0 and later.

(NEW)
3.19 mf status being set even when EALU operation is discarded

A typical method of doing an MPY-only instruction on a PP is to code an EALU instruction in parallel with the MPY instruction making the destination of the EALU instruction the same as the destination of the MPY instruction. In this way, the EALU result is discarded. Neither the status register (sr) nor the multiple flags (mf) register is supposed to be updated by this EALU instruction since it is purposely being discarded.

An errata exists such that the mf register is being updated based on the EALU instruction when it is not suppose to be updated at all.

Work Around:
If your code is relying on no mf status setting when the EALU operation is discarded, then you can work around this by setting up the EALU operation (which will be discarded) to produce ALU status setting identical to that already present.

Problem exists for silicon revisions: 1.0, 1.1, 1.2, 2.0, 3.0 and 3.1

Fix proposed for silicon revision: 4.0 and later.


Silicon 2.x Device Errata:

The following errata exists on silicon version 2.x devices.

2.1 TDI, TMS, TCK Pins:

The bias point of the TDI, TMS, and TCK input pins for the JTAG scan interface is incorrect. Inputs will be recognized as high at 0.65 Volts instead of 2.0 Volts.

Work Around:
A low-noise path between the Emulator Header connector and the C80 JTAG pins should be provided to prevent noise from causing low level inputs to be interpreted as logical high inputs.

Problem exists for silicon revisions: 1.0, 1.1, 1.2 and 2.0

Problem verified fixed for silicon revision: 3.0 and later.

2.2 Hardware Reset During Active Host Request:

If the HREQ^ is active low when the RESET^ input is driven active low, the C80's external memory interface will remain in high-impedance for several cycles after the completion of the hardware reset (behaving as though HREQ^ were still active). DRAM refresh cycles will not occur and the TC will not fetch the MP reset vector until the TC has determined that no host request is pending.

Work Around: Not needed.

Problem exists for silicon revisions: 1.0, 1.1, 1.2 and 2.0

Problem verified fixed for silicon revision: 3.0 and later.

2.3 Peripheral Device Transfers:

During Peripheral Device Packet Transfers, the DBEN^ signal is not driven high to disable C80 data transceivers. This will result in a drive conflict during Peripheral Device write cycles when both the C80 transceivers and the peripheral attempt to drive data

Work Around:
In systems that do not use transceivers on the C80 data bus, no work around is required as the C80's data bus will be placed in high impedance. Systems using C80 data bus transceivers can qualify DBEN^ to the transceivers with the row-time status code on STATUS[4:0] to disable DBEN^ during peripheral device PT cycles (STATUS[4:0] = 0010x).

Problem exists for silicon revisions: 1.0, 1.1, 1.2 and 2.0

Problem verified fixed for silicon revision: 3.0 and later.

2.4 Packet Transfer Crossbar Priority:

When accessing crossbar RAMs, both high priority and low priority packet transfers are given the low priority packet transfer priority. This causes both priority levels to operate below the priority of the PPs on the crossbar and may delay service of high priority packet transfers if contention occurs.

Work Around:
This condition may be avoided by careful programming to prevent processor and packet transfer contention. MP packet transfers submitted as urgent priority will correctly operate at the urgent PT level on the crossbar.

Problem exists for silicon revisions: 1.0, 1.1, 1.2 and 2.0

Problem verified fixed for silicon revision: 3.0 and later.

2.5 PP Loop Reload Register:

If one of the PP loop reload registers is updated using a loop reload register, (via a write to lrn, lrsn, or lrsen) while a cache miss is occurring, the register will be corrupted. For example:
lrse0 = lr0 - 1
causes lr0 to be corrupted.

Work Around:
Avoid updating the loop reload registers with their own contents. (Copy to an intermediate register first.)

Problem exists for silicon revisions: 1.0, 1.1, 1.2 and 2.0

Problem verified fixed for silicon revision: 3.0 and later.

2.6 Faulted PP Cache Services:

When a memory fault occurs during a PP instruction cache service the TC is supposed to write the address of the faulted location to the PP's parameter RAM. However if the TC was in the process of reading in a packet transfer parameter table when the cache service is begun then the incorrect address will be written to the parameter RAM if the memory fault occurs. This will prevent the MP from determining the faulting address.

Work Around:
Problem can be avoided by not storing PP instructions in faultable memory.

Problem exists for silicon revisions: 1.0, 1.1, 1.2 and 2.0

Problem verified fixed for silicon revision: 3.0 and later.

2.7 MP Data Cache Flush:

The dcache(c/f) instructions may write back data cache subblocks that are present and not dirty or that are not present.

Work Around:
A subblock should be checked to make sure both its present and dirty bits are set before issuing a dcache(c/f) command to it.

Problem exists for silicon revisions: 1.0, 1.1, 1.2 and 2.0

Problem verified fixed for silicon revision: 3.0 and later.

See also: errata 2.8 and 3.11

2.8 MP Data Cache Flush:

The dcachef command does not clear a subblock's present (p) bits unless the dirty (d) bit is set.

Work Around:
If the entire data cache is being flushed, then a cmnd 0x08000100 may be used to clear all the present bits. If only part of the cache is to be flushed, then the TAG registers can be examined to find the appropriate TAG and the P bit cleared by hand using rdcr and wrcr commands (after ensuring that the cache controller is idle using a ld r0(r0),r0 command). Alternatively, a "dummy" write to a location within the subblock (ld location to a register and then st it back) may be performed to ensure that the dirty bit is set prior to issuing the dcachef command.

Problem exists for silicon revisions: 1.0, 1.1, 1.2 and 2.0

Problem verified fixed for silicon revision: 3.0 and later.

See also: errata 2.7 and 3.11

2.9 Extra Wait States for READY from FAULT^ or RETRY^:

This applies to all one cycle per column memory waveforms except refresh. When RETRY^ or FAULT^ are sampled LOW just after RL FALL (r3 state) the C80 returns to the RL HIGH state (r1 state). In this case READY is then sampled when it should not be, in the r1 state, one cycle after RETRY^ and FAULT^ were sampled (r3 state). If READY were LOW at this point, it would have the effect of extending RL HIGH until READY is sampled HIGH.

This bug means that occasionally wait states may be inserted during RL HIGH when they are not needed. These wait states should be harmless as the C80 will appear as if it were idling in the r1 state. These wait states will cease to be inserted once READY becomes HIGH.

Work Around:
The bug can be avoided by ensuring READY is not LOW, in the r1 state, one cycle after RETRY^ and FAULT^ are sampled LOW when using one cycle per column memory waveforms.

Problem exists for silicon revisions: 1.0, 1.1, 1.2 and 2.0

Problem verified fixed for silicon revision: 3.0 and later.

2.10 READY incorrectly prioritized with respect to FAULT^ or RETRY^:

If READY and RETRY^ or READY and FAULT^ are active together then READY is disabled within the C80. This does not have any effect on the resampling of READY once it is active.

Work Around: None.

Problem exists for silicon revisions: 1.0, 1.1, 1.2 and 2.0

Problem verified fixed for silicon revision: 3.0 and later.


Silicon 1.x Device Errata:

The following errata exists on silicon version 1.x devices.

1.1 Packet Transfer Using Fill with Value:

When a packet transfer using the Fill with Value Src operation (bits 14-12 of PT Options field set to 001) is performed, the TC incorrectly checks the validity of the Src Start Address. An invalid Src Start Address will cause the packet transfer to terminate with a fault.

Work Around:
This problem may be avoided by ensuring that the Src Start Address field in the PT Parameter Table has been programmed to 0x00000000 or some other valid address before submitting the packet transfer.

Problem exists for silicon revisions: 1.0, 1.1 and 1.2

Problem verified fixed for silicon revision: 2.0 and later.

1.2 Host Request During SRT Cycle:

If a Host Request occurs (HREQ^ goes active low) during an SRT cycle, the tap point of the SRT cycle (output on A[31:0] at column time) may get corrupted.

Work Around:
For a display buffer the error will cause incorrect data to be displayed for the portion of the frame generated by the SRT cycle. This will merely result in a brief flicker on the display so no work around may be required. For capture and merge/capture buffers, incorrect data will be placed in the VRAM array. This problem may be avoided by monitoring the REQ[1:0] outputs and not generating a Host Request when an SRT is pending (REQ[1:0] = 11).

Problem exists for silicon revisions: 1.0, 1.1 and 1.2

Problem verified fixed for silicon revision: 2.0 and later.

1.3 Packet Transfer Retries:

If a retry occurs during a packet transfer and another transfer request of equal priority is pending, the retried transfer will be always be suspended. The retried packet transfer should only be suspended if it has been serviced for PTMIN number of cycles.

Work Around: None.
This condition can only occur if RETRY^ is asserted during a packet transfer's off-chip memory access.

Problem exists for silicon revisions: 1.0, 1.1 and 1.2

Problem verified fixed for silicon revision: 2.0 and later.

1.4 Reset Halt:

The MP should halt after reset if HREQ^ is high at the rising edge of RESET^. However, if the MP has already been reset once in halt mode it will come out of reset running if HREQ^ is held high during RESET^.

Work Around:
The MP reset halt operation can be achieved by generating a rising edge of HREQ^ while RESET^ is active low and maintaining HREQ^ high until RESET^ is driven inactive.

Problem exists for silicon revisions: 1.0, 1.1 and 1.2

Problem verified fixed for silicon revision: 2.0 and later.

1.5 Transfer Controller Request Priorities:

The Transfer Controller does not correctly reevaluate request priorities during crossbar contention. If a high priority request (such as an SRT request) occurs, then the request of the current operation is raised to that of the higher priority request so that the current operation can complete as soon as possible. If the current operation is stalled due to crossbar contention, the crossbar priority level is not raised as it should be. This can result in extended contention and delay in completion of the current operation.

Work Around:
This condition is most likely to occur when a packet transfer is contending for a RAM with a PP which is accessing the RAM every cycle. This can be avoided by careful programming to avoid processor and packet transfer contention.

Problem exists for silicon revisions: 1.0, 1.1 and 1.2

Problem verified fixed for silicon revision: 2.0 and later.

1.6 Column Time Address Signals:

The User's Guide specifies that address lines A[2:0] will always output the current byte address (address bits A(2:0)) at column time regardless of the address shift. On Rev 1.x devices, A[2:0] are valid at column time only for an address shift of 000.

Work Around:
Column time byte addresses must be taken from their shifted position on the address bus (somewhere within A[17:8], depending on the shift amount) for cycles with a non-zero address shift.

Problem exists for silicon revisions: 1.0, 1.1 and 1.2

Problem verified fixed for silicon revision: 2.0 and later.

1.7 FPU Accumulator "collision":

A collision occurs when the FPU multiplier and the FPU adder (ALU) both have an instruction in their last stages at the same time. When the result of an FPU ALU instruction is being written to a FPU accumulator at the same time the FPU multiplier tries to write its result to the register file (or to the FPU ALU in the case of an output denormal), a collision occurs, and the FPU accumulator is not updated with the FPU ALU result.

Work Around:
Arrange code so that a collision does not occur when the FPU ALU result is to an accumulator.

Problem exists for silicon revisions: 1.0, 1.1 and 1.2

Problem verified fixed for silicon revision: 2.0 and later.

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