'C8x devices now sampling

The 'C82 is now sampling in a low-cost, surface-mountable ball grid array (BGA) package, which uses solder balls as leads attached to the bottom of the package.

The 'C82, which features a 32-bit RISC master processor with IEEE-754 floating-point hardware and two 32-bit parallel, advanced DSPs on the same piece of silicon, will be in a 352-pin plastic BGA. This package will allow for future 'C8x device offerings using the same package.

Also, the new 60-MHz 'C80 device is sampling in the 305-pin PGA package.

Planned production dates for both devices are 1Q97.